Techweb reported on March 5 that blogger @i Bing universe disclosed on the social platform that Qualcomm’s flagship processors in the second half of this year and next year will be OEM by TSMC, so the power consumption control will be better.

According to Qualcomm’s naming rules, Qualcomm’s commercial flagship chip in the second half of this year will be named Xiaolong 8 GEN1 plus, while next year’s flagship processor will be named Xiaolong 8 Gen2, which will be OEM by TSMC.

It is worth noting that Qualcomm Xiaolong 888 and Xiaolong 8 GEN1 are OEM by Samsung.

Previously, insiders @ mobile phone chip experts disclosed that the yield of TSMC OEM was higher than that of Samsung. Take Xiaolong 8 GEN1 plus as an example. Since the third quarter, Xiaolong 8 GEN1 plus has produced more than 50000 films every quarter. At present, the yield has exceeded 70%, which is much higher than that of Xiaolong 8 GEN1 manufactured by Samsung.

From this point of view, Qualcomm Xiaolong 8 GEN1 plus and Xiaolong 8 Gen2 are OEM by TSMC, which may be due to the low yield of Samsung.

In addition, Qualcomm has released a new generation of 5g modem Xiaolong X70, which may be integrated into Qualcomm Xiaolong 8 Gen2.

It is reported that Xiaolong X70 is the most complete 5g modem and RF system series in the world, providing great flexibility for terminal manufacturers to design terminals that meet the requirements of global operators.

More importantly, Xiaolong X70 supports 10Gbps 5g peak download speed and brings new advanced functions, such as Qualcomm 5g AI suite, Qualcomm 5g ultra-low delay suite and four carrier aggregation.

To sum up, as the strongest 5g chip of Qualcomm, Xiaolong 8 Gen2 manufactured by TSMC is expected to perform.